US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 14 for "Multi-function etching sacrificial layers to protect three-dimensional dummy fins in semiconductor devices" (Taiwanese Inventors)

Posted On: 2026-07-14

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,098, issued on July 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Multi-function etching sacrific... Read More

US Patent Issued to Applied Materials on July 14 for "Method of multi-layer die stacking with die-to-wafer bonding" (Singaporean, American Inventors)

Posted On: 2026-07-14

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ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,099, issued on July 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Method of multi-layer die stacking with die-to-wafer... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 14 for "Redistribution layer metallic structure and method" (Taiwanese Inventors)

Posted On: 2026-07-14

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ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,100, issued on July 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Redistribution layer metallic s... Read More

US Patent Issued to NANYA TECHNOLOGY on July 14 for "Semiconductor device with a liner layer" (Taiwanese Inventor)

Posted On: 2026-07-14

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ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,101, issued on July 14, was assigned to NANYA TECHNOLOGY Corp. (New Taipei, Taiwan). "Semiconductor device with a liner layer" was invented... Read More

US Patent Issued to International Business Machines on July 14 for "Advanced pitch interconnects with multiple low aspect ratio segments" (New York Inventors)

Posted On: 2026-07-14

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ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,102, issued on July 14, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Advanced pitch interconnects with multiple l... Read More

US Patent Issued to International Business Machines on July 14 for "Metal wires with expanded sidewalls" (New York Inventors)

Posted On: 2026-07-14

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ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,103, issued on July 14, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Metal wires with expanded sidewalls" was inv... Read More

US Patent Issued to STMicroelectronics (Rousset) on July 14 for "Contact for electronic component" (French Inventors)

Posted On: 2026-07-14

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ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,104, issued on July 14, was assigned to STMicroelectronics (Rousset) SAS (Rousset, France). "Contact for electronic component" was invented... Read More

US Patent Issued to HON HAI PRECISION INDUSTRY on July 14 for "Forming method of interconnect structure" (Taiwanese Inventors)

Posted On: 2026-07-14

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ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,105, issued on July 14, was assigned to HON HAI PRECISION INDUSTRY Co. LTD. (New Taipei City, Taiwan). "Forming method of interconnect stru... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING, NATIONAL YANG MING CHIAO TUNG UNIVERSITY on July 14 for "Package structure and method for fabricating the same" (Taiwanese Inventors)

Posted On: 2026-07-14

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ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,106, issued on July 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan) and NATIONAL YANG MING CHIAO TUNG ... Read More

US Patent Issued to Applied Materials on July 14 for "Method to improve interconnect coefficient of thermal expansion" (New York, California Inventors)

Posted On: 2026-07-14

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ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,108, issued on July 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Method to improve interconnect coefficient of therma... Read More

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US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 14 for "Multi-function etching sacrificial layers to protect three-dimensional dummy fins in semiconductor devices" (Taiwanese Inventors)

US Patent Issued to Applied Materials on July 14 for "Method of multi-layer die stacking with die-to-wafer bonding" (Singaporean, American Inventors)

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 14 for "Redistribution layer metallic structure and method" (Taiwanese Inventors)

US Patent Issued to NANYA TECHNOLOGY on July 14 for "Semiconductor device with a liner layer" (Taiwanese Inventor)

US Patent Issued to International Business Machines on July 14 for "Advanced pitch interconnects with multiple low aspect ratio segments" (New York Inventors)

US Patent Issued to International Business Machines on July 14 for "Metal wires with expanded sidewalls" (New York Inventors)

US Patent Issued to STMicroelectronics (Rousset) on July 14 for "Contact for electronic component" (French Inventors)

US Patent Issued to HON HAI PRECISION INDUSTRY on July 14 for "Forming method of interconnect structure" (Taiwanese Inventors)

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING, NATIONAL YANG MING CHIAO TUNG UNIVERSITY on July 14 for "Package structure and method for fabricating the same" (Taiwanese Inventors)

US Patent Issued to Applied Materials on July 14 for "Method to improve interconnect coefficient of thermal expansion" (New York, California Inventors)